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oil_bare_silicon.config
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oil_bare_silicon.config
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# This is an example hotspot configuration file.
# It demonstrates the importance of secondary heat transfer path
# in a special cooling scenario -- oil flowing over bare # silicon
# during infrared thermal measurements.
# Convergence is in this oil config slower than typical heatsink configs.
#
# More details about this configuration can be found in the following papers:
# 1. F. J. Mesa-Martinez, J. Nayfach-Battilana, and J. Renau.
# "Power model validation through thermal measurements".
# In Proc. of International Symposium on Computer Architecture
# (ISCA), 2007.
# 2. W. Huang, K. Skadron, S. Gurumurthi, R. Ribando and M. Stan.
# "Differetiating the Roles of IR Measurement and Simulation for
# Power and Temperature-Aware Design”, International Symposium on
# Performance Analysis of Systems and Software (ISPASS), 2009.
# thermal model parameters
# chip specs
# chip thickness in meters
-t_chip 0.0005
# silicon thermal conductivity in W/(m-K)
-k_chip 100.0
# silicon specific heat in J/(m^3-K)
-p_chip 1.75e6
# temperature threshold for DTM (kelvin)
-thermal_threshold 354.95
# heat sink specs
# convection capacitance in J/K
-c_convec 0.077
# convection resistance in K/W
-r_convec 1.042
# heatsink side in meters
-s_sink 0.0202 # virtually no heatsink
# heatsink thickness in meters
-t_sink 0.00001
# heatsink thermal conductivity in W/(m-K)
-k_sink 400.0
# heatsink specific heat in J/(m^3-K)
-p_sink 3.55e6
# heat spreader specs
# spreader side in meters
-s_spreader 0.0201 # virtually no heat spreader
# spreader thickness in meters
-t_spreader 0.00001
# heat spreader thermal conductivity in W/(m-K)
-k_spreader 400.0
# heat spreader specific heat in J/(m^3-K)
-p_spreader 3.55e6
# interface material specs
# interface material thickness in meters
# this is actually the oil thermal boundary layer thickness
-t_interface 1.0e-06
# oil thermal conductivity in W/(m-K)
-k_interface 4.0
# oil specific heat in J/(m^3-K)
-p_interface 4.0e6
# secondary path (C4/underfill, package substrate, solder balls etc)
# only available in the grid model
# model secondary path or not?
-model_secondary 1
# convection resistance at the air/PCB interface in K/W
-r_convec_sec 0.2
# convection capacitance at the sir/PCB interface in J/K
-c_convec_sec 40.0
# number of on-chip metal layers
-n_metal 8
# one metal layer thickness in meters
-t_metal 100.0e-6
# C4/underfill thickness in meters
-t_c4 0.0001
# side size of EACH C4 pad
-s_c4 20.0e-6
# number of C4 pads
-n_c4 400
# package substrate side in meters
-s_sub 0.021
# package substrate thickness in meters
-t_sub 0.001
# solder ball side in meters
-s_solder 0.021
# solder ball thickness in meters
-t_solder 0.00094
# PCB side in meters
-s_pcb 0.1
# PCB thickness in meters
-t_pcb 0.002
# others
# ambient temperature in kelvin
-ambient 318.15
# initial temperatures from file
-init_file (null)
# initial temperature (kelvin) if not from file
-init_temp 273.15
# steady state temperatures to file
-steady_file (null)
# hotspot calling interval - 10K cycles at 3GHz
-sampling_intvl 3e-3
# base processor frequency in Hz
-base_proc_freq 3e+09
# is DTM employed?
-dtm_used 0
# model type - block or grid
-model_type grid
# consider temperature-leakage loop within HotSpot?
-leakage_used 0
# leakage calculation modes: (only valid when -leakage_used=1)
# 0 user-defined leakage power model, do temp-leakage loop within HotSpot
# 1 use HotLeakage -- !NOT implemented in this release!, coming later.
-leakage_mode 0
# use detailed package model?
-package_model_used 0
-package_config_file package.config
# block model specific parameters
# omit lateral chip resistances?
-block_omit_lateral 0
# grid model specific parameters
# grid resolution - no. of rows
-grid_rows 32
# grid resolution - no. of cols
-grid_cols 32
# layer configuration from file
-grid_layer_file (null)
# dump internal grid steady state temperatures
-grid_steady_file (null)
# grid to block mapping mode - (avg|min|max|center)
# i.e., a block's temperature is the avg, min or max
# of all the grid cells in it or equal to that of
# the grid cell in its center
-grid_map_mode center
# floorplanner parameters
# L2 modeling
# wrap around L2?
-wrap_l2 1
# name of the L2 unit to look for
-l2_label L2
# rim modeling
# model dead space around the rim of the chip?
-model_rim 0
# thickness of the rim in meters
-rim_thickness 5e-05
# others
# area ratio below which to ignore dead space
-compact_ratio 0.005
# no. of discrete orientations for a shape curve (even no. > 1)
-n_orients 300
# annealing parameters
# initial acceptance probability
-P0 0.99
# average change (delta) in cost
-Davg 1
# no. of moves to try in each step
-Kmoves 7
# ratio for the cooling schedule
-Rcool 0.99
# ratio of rejects at which to stop annealing
-Rreject 0.99
# absolute max no. of annealing steps
-Nmax 1000
# weights for the metric: lambdaA * A + lambdaT * T + lambdaW * W
# weight for the area term
-lambdaA 5.0e+06
# weight for the temperature term
-lambdaT 1
# weight for the wire length term
-lambdaW 350